Current plan is that each set will contain:


In a simple plastic bag, with nothing soldered.

It is ready to go ahead now. Only delay is certification (as I want to do this in combination with the new batch order, to keep costs down).

Regards, Mark.

On 23 Apr 2019, at 2:25 PM, Craig Leres <leres@xse.com> wrote:

On 2019-04-22 20:10, Mark Webb-Johnson wrote:
Some more prototype pictures. There is about 6.5m space between the top of the board and standard case; that is tight, but just about ok for normal components.

That looks really good to me. There are a pair of 1x14 sockets tacked onto it? Will there be standoffs too?

Craig