[Ovmsdev] It's Here!

Mark Webb-Johnson mark at webb-johnson.net
Mon Apr 16 12:45:05 HKT 2018


That makes more sense.

Glad to hear all good now.

Regards, Mark.

> On 16 Apr 2018, at 11:50 AM, Greg D. <gregd2350 at gmail.com> wrote:
> 
> Hi Mark,
> 
> An update!!  So, I thought I'd open up the unit and see what was going on with the case by itself.  The moment I released one of the screws, there was a snap! and the side popped into place.  It is now in perfect alignment.
> 
> I don't remember which screw it was, but it seems that the PC board wasn't seated properly when the case was assembled.
> 
> So, not a defect in the material, but rather in the assembly process.
> 
> Greg
> 
> 
> Greg D. wrote:
>> Hi Mark,
>> 
>> It's totally cosmetic, and the unit will be under the dash in the car,
>> so nobody else will see it (or if they do, I'll call it a proto unit :)
>> ).  Unless you want this one back, I am fine with keeping it.  Just
>> thought you should know about it.
>> 
>> Greg
>> 
>> 
>> Mark Webb-Johnson wrote:
>>> Greg,
>>> 
>>> That is nasty. It must be a manufacturing defect, as I haven’t seen anything like that on other cases (and I’ve seen about 25 of them).
>>> 
>>> I’ll send you another case in the mail, when I next go to the post office.
>>> 
>>> Regards, Mark.
>>> 
>>>> On 15 Apr 2018, at 3:14 AM, Greg D. <gregd2350 at gmail.com> <mailto:gregd2350 at gmail.com> wrote:
>>>> 
>>>> Hard to measure the overhang...  Here's what it looks like. 
>>>> 
>>>> I think the dust cap issue depends on how the sealing flap is closed
>>>> over the module, i.e. whether the sticky part is fully attached to the
>>>> body of the envelope, or whether it's done loosely, leaving a bit of the
>>>> adhesive exposed to the contents.  I got "lucky" in that regard :(.
>>>> 
>>>> Greg
>>>> 
>>>> 
>>>> Michael Balzer wrote:
>>>>> Got mine as well, without customs hassle.
>>>>> 
>>>>> My dust caps were in place and OK. The top shell also is a bit wider than the bottom, but nowhere near 1 mm, more like 0.2 - 0.3.
>>>>> 
>>>>> Regards,
>>>>> Michael
>>>>> 
>>>>> 
>>>>> Am 14.04.2018 um 00:49 schrieb Greg D.:
>>>>>> Hi Mark,
>>>>>> 
>>>>>> The 3.1 module arrived in today's mail.  I haven't plugged it in yet,
>>>>>> but two "unboxing" observations...
>>>>>> 
>>>>>> The unit looks really nice, though it seems that the top shell is a tad
>>>>>> too wide and overlaps the bottom piece by nearly a mm on one corner. 
>>>>>> And, not evenly, at that; it's like the corner by the Vehicle connector
>>>>>> got stretched a bit outward (or the other half pushed inward).  The
>>>>>> other two sides are all pretty evenly matched.  The 3.0 proto unit was
>>>>>> not like this.  {shrug} 
>>>>>> 
>>>>>> Also, the two SMA dust caps seemed to have had some reaction with the
>>>>>> adhesive on the flap of the padded envelope.  They were stuck to the
>>>>>> flap, pulled away from the connectors (so, not much dust protection),
>>>>>> and the adhesive on the flap seemed to be very gooey in that area.  The
>>>>>> caps seemed to have been more or less unaffected, so it's more of a
>>>>>> cosmetic issue.  Perhaps they could point the module in the other
>>>>>> direction (SMA end first), to prevent this in the future?
>>>>>> 
>>>>>> My intent is to play "customer" with this unit, only using officially
>>>>>> released code, updated through typical methods (i.e. not via the
>>>>>> developer's kit) unless I need to do otherwise.  I've got some
>>>>>> short-term distractions through the weekend, but will take it out for a
>>>>>> spin next week.
>>>>>> 
>>>>>> Greg
>>>>>> 
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